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Plastronics Single Beam BGA Socket
Plastronics has developed a new socket using Single Beam contacts for BGA devices with pitches ranging from 0.4mm to 1.0mm. The Single Beam technology enables the creation of ultra-compact sockets that fit large matrices. It is compatible with DDR I to III.
High-performance elastomer used GHz BGA socket
A socket that is perfect for evaluating and verifying devices such as BGA and QFN! - Contact reliability that is not affected by the size or pitch of the device. - Utilizes high-performance elastomers to achieve low contact resistance, making evaluation at GHz levels feasible due to minimal distance between the device and the substrate. - Can be implemented even with components around the substrate (*). - The device can be directly implemented after evaluation. *Please consult us in advance regarding the substrate you are using.
A variety of products are lined up from micro BGA sockets to BGA conversion interposers!
This catalog features a wide range of products related to BGA sockets from Advanced Interconnections. Starting with the surface mount "Micro BGA Socket," which requires no screws or other fasteners to secure the outer perimeter, we also include many products such as "BGA Adapters" that can be mounted with the same footprint as BGA devices. Additionally, we introduce products like "Flip-Top BGA Sockets" and "BGA Conversion Interposers," making this a useful resource for product selection. [Contents (excerpt)] ■ Product Features ■ Product Specifications ■ Product List ■ Options ■ Order Codes (Part Number Codes) ■ Usage Instructions *For more details, please refer to the PDF document or feel free to contact us.
Plastronics Cam Lever Open Top BGA Socket
●Standard lineup ●Ideal for manual testing of multi-pin BGA ●Optimal for analysis as no lid is required ●Contact method with single-side contact prevents damage to the ball mounting surface
A wide variety of pogo pin type BGA sockets that do not require soldering are available!
The "BGA Socket Series" handled by Tokyo Eletech (TET) features a BGA mounting section with pogo pins (movable pins), allowing BGA components to be mounted without soldering. It is a surface mount type compatible with packages such as BGA and LGA, and can also be connected to emulator cables and circuit boards. Additionally, we accept the development of custom products that accommodate special shapes, multiple pins, and very small pitches. 【Features】 ■ BGA mounting section uses pogo pins (movable pins) ■ BGA can be mounted without soldering ■ Can also be connected to emulator cables and circuit boards *For more details, please refer to the PDF materials or feel free to contact us.
